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AMD Turion II Dual-Core Mobile N570 - TMN570DCR23GM基本资料
类别:CPU 制造商:AMD
家族:Turion II Dual-Core Mobile 产品:AMD Turion II Dual-Core Mobile N570 - TMN570DCR23GM
类型 CPU / Microprocessor
细分市场 Mobile
系列
AMD Turion II Dual-Core Mobile
型号    N570
CPU 编号
  • TMN570DCR23GM is an OEM/tray microprocessor
Stepping code AAEKC AE
频率    2700 MHz
总线速度    One 1800 MHz 16-bit HyperTransport link (3.6 GT/s)
时钟倍频器    13.5
封装 638-pin lidless organic micro Pin Grid Array (UOL638)
AMD 封装 number 30600
接口 接口 S1 (S1g4)
尺寸 1.38" x 1.38" / 3.5cm x 3.5cm
Weight 0.2oz / 5.6g (measured)
0.2oz / 6.5g (by specifications)
发布时间 Jan 4, 2011
End-of-Life date Last order date is end of 2nd quarter 2011
Last shipment date is end of 4th quarter 2011
架构 / 微体系结构
微体系结构 K10
Platform Danube
处理器内核    Champlain
Core stepping    DA-C3
CPUID 100F63
制造工艺 0.045 micron silicon-on-insulator (SOI) technology
数据位宽 64 bit
The number of cores 2
线程数 2
浮点单元 Integrated, 128-bit wide
1级缓存大小    2 x 64 KB 2-way set associative instruction caches
2 x 64 KB 2-way set associative data caches
2级缓存大小    2 x 1 MB 16-way set associative caches
Level 3 cache size None
多重处理 Uniprocessor
特征
  • MMX instructions
  • Extensions to MMX
  • 3DNow! technology
  • Extensions to 3DNow!
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSE4a   
  • AMD64 / AMD 64-bit technology   
  • EVP / Enhanced Virus Protection   
  • AMD-V / AMD Virtualization technology
低功耗特性 PowerNow!
集成外设/组件
集成显卡 None
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1066, DDR3L-1066
Maximum memory bandwidth (GB/s): 17.1
Other peripherals HyperTransport technology 3.0
电/热参数
热设计功耗    35 Watt
其它cpu Part Number