| 类型 | CPU / Microprocessor |
| 细分市场 | Mobile |
| 系列 | AMD Turion II Neo Dual-Core Mobile |
| 型号 | K645 |
| CPU 编号 |
|
| 频率 | 1600 MHz |
| 总线速度 | One 1600 MHz 16-bit HyperTransport link (3.2 GT/s) |
| 时钟倍频器 | 8 |
| 封装 | 812-ball ASB2 BGA |
| 接口 | BGA812 |
| 尺寸 | 1.06" x 1.06" / 2.7cm x 2.7cm |
| 发布时间 | Jan 4, 2011 |
| End-of-Life date | Last order date is end of 3rd quarter 2011 Last shipment date is end of 1st quarter 2012 |
| 架构 / 微体系结构 | |
| 微体系结构 | K10 |
| Platform | Nile |
| 处理器内核 | Geneva |
| Core stepping | DA-C3 |
| CPUID | 100F63 |
| 制造工艺 | 0.045 micron silicon-on-insulator (SOI) technology |
| 数据位宽 | 64 bit |
| The number of cores | 2 |
| 线程数 | 2 |
| 浮点单元 | Integrated, 128-bit wide |
| 1级缓存大小 | 2 x 64 KB 2-way set associative instruction caches 2 x 64 KB 2-way set associative data caches |
| 2级缓存大小 | 2 x 1 MB 16-way set associative caches |
| Level 3 cache size | None |
| 多重处理 | Uniprocessor |
| 特征 |
|
| 低功耗特性 | PowerNow! |
| 集成外设/组件 | |
| 集成显卡 | None |
| Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3-800, DDR3L-800 Maximum memory bandwidth (GB/s): 12.8 |
| Other peripherals | HyperTransport technology 3.0 |
| 电/热参数 | |
| 热设计功耗 | 15 Watt |
