类型 | CPU / Microprocessor |
细分市场 | Mobile |
系列 | AMD Turion *4 Mobile technology |
型号 | ML-3* |
CPU 编号 |
|
CPU步进 | CABSE GABSE |
频率 | 2000 MHz |
总线速度 | One 800 MHz 1*-bit HyperTransport link |
时钟倍频器 | 10 |
封装 | **4-pin lidless organic micro-PGA 1.**" x 1.**" (4 cm x 4 cm) |
AMD 封装 number | 28331 |
接口 | 接口 **4 |
发布时间 | Mar 10, 200* |
指导价格 | $3*4 |
架构 / 微体系结构 | |
微体系结构 | K8 |
处理器内核 | Lancaster |
Core stepping | SH-E* |
CPUID | 20F42 |
制造工艺 | 0.0* micron silicon-on-insulator (SOI) technology 114 million transistors |
模具尺寸 | 11*mm2 |
数据位宽 | *4 bit |
The number of cores | 1 |
线程数 | 1 |
浮点单元 | Integrated |
1级缓存大小 | *4 KB 2-way set associative instruction cache *4 KB 2-way set associative data cache |
2级缓存大小 | 1 MB 1*-way set associative exclusive cache |
Physical memory | 1 TB |
Virtual memory | 2** TB |
多重处理 | Uniprocessor |
特征 |
|
低功耗特性 |
|
集成外设/组件 | |
集成显卡 | None |
Memory controller | The number of controllers: 1 Memory channels: 1 Channel width (bits): *4 Supported memory: DDR-200, DDR-2**, DDR-333, DDR-400 [1] Maximum memory bandwidth (GB/s): 3.2 [1] |
Other peripherals | HyperTransport interface (1 link) |
电/热参数 | |
V核 | 1.3*V |
Maximum operating temperature | **°C |
热设计功耗 | 3* Watt |
Notes on AMD Turion *4 ML-3* | |
[1] - Information is not confirmed |