| 类型 | CPU / Microprocessor |
| 细分市场 | Server |
| 系列 | AMD Third Generation Opteron |
| 型号 | 2347 HE |
| CPU 编号 |
|
| 频率 | 1900 MHz |
| 总线速度 | 1600 MHz (integrated memory controller) 1000 MHz (HyperTransport links) |
| 封装 | 1207-land lidded LGA |
| 接口 | 接口 Fr2(1207) |
| 发布时间 | Sep 10, 2007 |
| 指导价格 | $377 |
| 架构 / 微体系结构 | |
| 微体系结构 | K10 |
| 处理器内核 | Barcelona |
| Core stepping | BA |
| 制造工艺 | 0.065 micron silicon-on-insulator (SOI) technology 463 million transistors |
| 模具尺寸 | 285mm2 |
| 数据位宽 | 64 bit |
| The number of cores | 4 |
| 线程数 | 4 |
| 浮点单元 | Integrated |
| 1级缓存大小 | 4 x 64 KB 2-way associative instruction cache 4 x 64 KB 2-way associative data cache |
| 2级缓存大小 | 4 x 512 KB 8-way set associative cache |
| Level 3 cache size | 2 MB 32-way set associative shared cache |
| Physical memory | 256 TB |
| 多重处理 | Up to 2 processors |
| 特征 |
|
| 低功耗特性 |
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| 集成外设/组件 | |
| 集成显卡 | None |
| Memory controller | The number of controllers: 1 Memory channels: 2 Channel width (bits): 72 Supported memory: DDR2 |
| Other peripherals | HyperTransport technology with three 16-bit links up to 1000 MHz each |
| 电/热参数 | |
| V核 | 1.15V |
| Minimum operating temperature | 0°C |
| Maximum operating temperature | 55°C - 71°C |
| Average CPU Power | 55 Watt |
| 热设计功耗 | 79 Watt (According to final ACP white paper) 68 Watt (According to press presentation) |
