一般信息 | |
类型 | |
系列 | |
Processor number | E3825 |
部件号 | FH8065301567313 |
频率 (GHz) | 1.333 |
封装 type | 1170-ball micro-FCBGA |
接口 type | BGA1170 |
Availability date | July 7, 2014 |
架构 / 微体系结构 / Other | |
Core stepping | D0 |
Qualification sample | |
Previous stepping | |
处理器内核 | Bay Trail-I |
Manufacturing technology (micron) | 0.022 |
Number of cores | 2 |
L2 cache size (MB) | 1 |
特征 | AES EM64T technology Execute disable bit MMX SSE SSE2 SSE3 SSE4 SSSE3 Virtualization technology (VT-x) |
Case temperature (°C) | 110 |
热设计功耗 (Watt) | 6 |
Notes on sSpec SR1X9 | |
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